• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method (100) for aligning a first substrate (201), in particular a mask, with a second substrate (203), in particular a wafer, with: inserting (101) the first substrate (201) and the second substrate ( 203) in a positioning device (205); Receiving (103) at least one common image (301) of the first substrate (201) and the second substrate (203); Displaying (105) the image (301); Marking (107) a plurality of pixels in the image (301) by a user; and determining (109) a control command for driving the positioning means (205) on the basis of the marked pixels, so that the substrates (201, 203) are aligned with each other.
    公开号:AT519921A2
    申请号:T50329/2018
    申请日:2018-04-19
    公开日:2018-11-15
    发明作者:
    申请人:Suss Microtec Lithography Gmbh；
    IPC主号:
    专利说明:

    SUMMARY
    The invention relates to a method (100) for aligning a first substrate (201), in particular a mask, to a second substrate (203), in particular a wafer, with: inserting (101) the first substrate (201) and the second substrate ( 203) into a positioning device (205); Capturing (103) at least one common image (301) of the first substrate (201) and the second substrate (203); Displaying (105) the image (301); Marking (107) a plurality of pixels in the image (301) by a user; and determining (109) a control command for actuating the positioning device (205) on the basis of the marked pixels so that the substrates (201, 203) are aligned with one another.
    (Fig. 1) / 22
    The present invention relates to the field of aligning substrates, in particular in a mask aligner or a bond aligner.
    Alignment of two substrates arranged one above the other is known in semiconductor technology. For example, in mask aligners, a photo mask and a wafer are precisely aligned with one another before the wafer is exposed through the photo mask. In BondAligners, two wafers are also initially aligned with one another before they are then permanently or temporarily connected (bonded). This alignment is done either manually by a user or automatically.
    In manual alignment, the user usually controls the movement of at least one of the substrates directly using a joystick. This direct control requires the user to have a precise understanding of which position change of one substrate relative to the other substrate is caused by an input with the joystick. For this reason, manual alignment must first be learned by the user, which can lead to considerable expenditure of time and money.
    In the case of automatic alignment (autoalignment), an offset and a rotation of the substrates relative to one another are detected automatically, for example by means of recognizing complementary alignment marks on the substrate surfaces using image recognition software. The wafers are then aligned fully automatically without the need for a user input. However, this type of alignment is complex because the image recognition software must first be trained to recognize the alignment marks (target training).
    Furthermore, only substrates with suitable alignment marks can be aligned using auto-alignment. The alignment marks must not be confused or damaged, for example, and must also be recognizable in the event of partial overlap. An automatic alignment of individual substrates with different types of alignment marks is therefore often not possible.
    It is therefore the object of the present invention to efficiently align two substrates, in particular a mask and a wafer. In particular, this alignment should be simple for a user and can be carried out without special knowledge.
    This object is solved by the features of the independent claims. Advantageous forms of further training are the subject of the dependent claims, the description and the drawings.
    According to a first aspect, the invention relates to a method for aligning a first substrate, in particular a mask, to a second substrate, in particular a wafer, with:
    / 22nd
    2 inserting the first substrate and the second substrate into a positioning device; Capturing at least one common image of the first substrate and the second substrate; Displaying the image; Marking a plurality of pixels in the image by a user; and determining a control command to control the positioning device on the basis of the marked pixels so that the substrates are aligned with one another. This has the advantage that the two substrates can be aligned with one another in a very simple manner. In particular, the frequently very complex positioning device is not directly controlled by the user, for example by means of a joystick, which simplifies the implementation of the method for the user. There is also no need to train image recognition software on certain adjustment marks.
    By means of the method, the substrates can be aligned with one another before subsequent merging and / or exposure, for example as part of a lithography or bonding process.
    The substrates can each be wafers. Furthermore, the first substrate can be a mask, in particular a lithography or photo mask, and the second substrate can be a wafer. The substrates can have structures, in particular alignment marks, alignment targets or alignment aids, for aligning the substrates.
    The substrates can each be formed from a semiconductor material, for example silicon (Si) or gallium arsenide (GaAs), a glass, for example quartz glass, a plastic or a ceramic. The first substrate and / or the second substrate can each be formed from a monocrystalline, a polycrystalline or an amorphous material. Furthermore, the substrates can each comprise a multiplicity of bonded materials.
    The substrates can comprise electrical circuits, for example transistors, light-emitting diodes or photodetectors, electrical conductor tracks which connect these circuits, or optical components, and also MEMS or MOEMS structures. The first substrate and / or the second substrate can furthermore have coatings, for example structured chrome layers, pre-crosslinked or hardened bond adhesives or separating layers.
    The at least one common image of the substrates can show surface sections of the first substrate and the second substrate, which are in particular arranged one above the other. In the surface sections, alignment marks and / or device structures can be visible, which can be used to align the substrates.
    A surface position on the first substrate or the second substrate can be assigned to each marked pixel in the image. Aligning the substrates to one another can include arranging the substrates one above the other, in such a way that the marked / 22
    - 3 surface positions of the substrates are aligned with each other. For example, the user marks an alignment mark of the first substrate and an alignment mark of the second substrate in succession in the image, and the positioning device then aligns the marked alignment marks with one another.
    If several common images are recorded and displayed, each of these images can show complementary alignment marks of the substrates. The user can mark the alignment marks one after the other in each image so that all complementary alignment marks are aligned with one another. Furthermore, on the basis of the marked alignment marks, an algorithm can be used to calculate an average of the offset of the substrates, on the basis of which the substrates are aligned with one another.
    According to one embodiment, the substrates are aligned laterally to one another in response to the receipt of the control command from the positioning device. This enables simple and quick alignment of the substrates without direct control of the positioning device by the user.
    According to one embodiment, a machine state, for example a current process step, a machine type or a machine configuration, is recorded before the control command is ascertained.
    According to one embodiment, the control command is additionally determined on the basis of the detected machine status. This has the advantage that the substrates can be aligned efficiently taking into account the machine condition. For example, it is determined which axes can be moved and / or cannot be moved in the current machine state.
    According to one embodiment, the plurality of pixels in the image are marked by the user by clicking on the pixels, for example with a peripheral device, or by means of a dragging movement of a mouse pointer. This has the advantage that the pixels can be marked particularly easily.
    According to one embodiment, the user marks the plurality of pixels in the image by touching a touch display. This has the advantage that the pixels can be marked particularly easily and intuitively. Marking can be done by deliberately touching the pixels on the touch display or by wiping the touch display.
    According to one embodiment, the method step of capturing the image comprises capturing a first common image and a second common image of the substrates, the first and the second common image being displayed next to one another, one above the other or alternately. This has the advantage that the substrates are particularly / 22
    - 4 can be aligned efficiently based on two images. In particular, a rotation or an angular offset of the substrates relative to one another can be corrected. Furthermore, the alignment can be carried out particularly simply and intuitively for the user.
    According to one embodiment, at least two pixels are marked in the first common image and at least two pixels in the second common image. This achieves the advantage that the substrates can be aligned with one another particularly efficiently on the basis of the two images. At each marked pixel there can be an alignment mark of the first or the second substrate in the first or the second image.
    According to a second aspect, the invention relates to a device for aligning a first substrate to a second substrate, with a positioning device into which the substrates can be inserted; an image recording device which is designed to record at least one common image of the substrates used in the positioning device; an input device with which a large number of pixels can be marked in the image; and a control element which is designed to determine a control command for actuating the positioning device on the basis of the marked pixels. This has the advantage that the two substrates can be aligned with one another in a very simple and efficient manner, without the need to train a user or an image recognition software.
    The device can be integrated in a production system for microstructure components, for example a mask aligner or a bond aligner.
    The positioning device can be designed to align the substrates to one another in response to the receipt of the control command, in particular to align them laterally to one another.
    According to one embodiment, the device comprises a display, in particular a screen or a display, for displaying the image. This has the advantage that the image can be displayed to the user, so that the user can mark the pixels in the display.
    According to one embodiment, the display and the input device form a touch display. This achieves the advantage that the user can mark the pixels particularly simply by touching the touch display, for example with a finger or an input pen or stylus.
    According to one embodiment, the input device is a peripheral device, for example a mouse, a trackball or a touchpad. This has the advantage that the user can mark the pixels particularly easily by operating the input device.
    / 22nd
    According to one embodiment, the positioning device comprises a substrate positioning device for the first substrate and / or
    Substrate positioning device for the second substrate. This has the advantage that the substrates can be positioned precisely with respect to one another. The substrate positioning devices can each allow the substrates to be moved with one or more degrees of freedom of movement.
    According to one embodiment, the image recording device comprises at least one microscope. This enables a particularly precise marking of pixels by the user. For example, the user can mark the centers or corners of alignment marks more precisely in an enlarged representation of the substrates, so that these are aligned with one another with greater accuracy.
    According to one embodiment, the image recording device comprises a number of image cameras which are arranged above and / or below and / or within the positioning device. This has the advantage that the common images can be taken efficiently.
    According to one embodiment, the image recording device comprises a movement device for positioning the number of image cameras, the movement device being controllable by means of the input device. This enables the image recording device to be precisely aligned with the substrates. Structures such as alignment marks on the substrate surfaces can thus be approached in a targeted manner using the image recording device.
    Furthermore, a magnification setting of the image recording device can be adjustable by means of the input device. For example, the user first moves the image recording devices until alignment marks or other relevant structures are visible. The user can then enlarge the representation of the substrates in the image recording in order to enable the most accurate marking of the alignment marks or the structures.
    Further exemplary embodiments are explained in more detail with reference to the accompanying drawings. Show it:
    1 shows a flow diagram of a method for aligning a first substrate with a second substrate;
    Fig. 2 is a schematic representation of a device for aligning a first
    Substrate to a second substrate;
    / 22nd
    3a-d show schematic representations of a common image of two substrates during an alignment of the substrates; and
    4a-b show schematic representations of a first common image and a second common image of two substrates during an alignment of the substrates.
    1 shows a flow diagram of a method 100 for aligning a first substrate to a second substrate according to an embodiment.
    The method 100 comprises inserting 101 the first substrate and the second substrate into a positioning device, taking 103 at least one common image of the first substrate and the second substrate, displaying 105 the image, marking 107 a plurality of pixels in the image a user, and determining 109 a control command for actuating the positioning device on the basis of the marked pixels so that the substrates are aligned with one another.
    Alignment 111 is performed by the positioning device in response to receiving the control command.
    Alignment 111 of the substrates relative to one another can include lateral alignment of the substrates. The alignment 111 of the substrates with respect to one another can further comprise arranging the substrates one above the other, in such a way that surface positions of the substrates which correspond to the marked pixels are aligned with one another.
    The first substrate can be a mask and the second substrate can be a wafer, in particular a semiconductor wafer. Furthermore, both substrates can be wafers, in particular semiconductor wafers or glass wafers. The substrates can have structures, in particular alignment marks, alignment targets or alignment aids, to support the alignment.
    By means of the method 100, the substrates can be aligned with one another before subsequent merging and / or exposure, for example as part of a lithography or bonding process.
    A machine state can be detected before the method step of determining 109 the control command. The machine status is, for example, a current process step, a machine type or a machine configuration. The detected machine state can include information about the type or the current configuration of the positioning device and / or an image recording device, or about a magnification setting during the image recording. The detected machine status can be taken into account when determining 109 the control command.
    / 22nd
    - Marking 107 of the pixels can be done by clicking on the pixels with a peripheral device or by touching a touch display. The user marks, for example, at least two pixels in each of the recorded common images. The first marked pixel can correspond to a surface position on the first substrate and the second marked pixel can correspond to a surface position on the second substrate. The user can orientate himself on structures on the substrate surfaces, such as alignment marks or nonies.
    The user can also carry out the marking 107 by means of a dragging movement of a mouse pointer or by means of a wiping movement on the touch display. For example, a starting point of the pulling or wiping movement marks the surface position on the first substrate and an end point of the pulling or wiping movement marks the surface position on the second substrate to which the surface position on the first substrate is to be aligned.
    The marked pixels can be highlighted graphically in the common image, for example by means of a colored marking of the pixels, a symbol which is displayed at the pixels, or by means of an arrow from the first marked pixel to the second marked pixel.
    The substrates can be aligned such that the respective surface positions, which correspond to the marked pixels, are arranged one above the other.
    After method 100 has been completed, a magnification setting of the at least one common image can be increased and method 100 can be carried out again. In this way, the substrates can be aligned with one another as precisely as possible.
    2 shows a device 200 for aligning the first substrate 201 to the second substrate 203 according to one embodiment.
    The device 200 comprises a positioning device 205 in which the substrates 201, 203 can be inserted, an image recording device 207 which is designed to record at least one common image of the substrates 201, 203 inserted in the positioning device 205, an input device 209 with which a large number of pixels in the image can be marked, and a control element 211, which is designed to determine a control command for actuating the positioning device 205 on the basis of the marked pixels.
    The device 200 can be integrated in a production plant for microstructure components, for example a mask aligner or a bond aligner.
    The substrates 201, 203 can each be wafers. Furthermore, the first substrate 201 can be a mask, in particular a lithography or photo mask, and the second substrate 203 can be a wafer / 22
    - be 8. The substrates 201, 203 can have complementary structures, in particular alignment marks, alignment targets or alignment aids, for aligning the substrates.
    The substrates 201, 203 can each be formed from a semiconductor material, for example silicon (Si) or gallium arsenide (GaAs), a glass, for example quartz glass, a plastic or a ceramic. The first substrate 201 and / or the second substrate 203 can each be formed from a monocrystalline, a polycrystalline or an amorphous material. Furthermore, the substrates 201, 203 can each comprise a multiplicity of connected materials.
    The substrates 201, 203 can be electrical circuits, for example transistors,
    Light-emitting diodes or photodetectors, electrical conductor tracks that connect these circuits, or optical components, as well as MEMS or MOEMS structures. The first substrate 201 and / or the second substrate 203 can furthermore have coatings, for example structured chrome layers, pre-crosslinked or hardened bonding adhesives or separating layers.
    The device 200 may comprise a display 213, for example a screen or a display, for displaying the image.
    The display 213 and the input device 209 can form a touch display. The pixels can be marked by touching the touch display. The input device 209 can further comprise a peripheral device, for example a mouse, a trackball, a touchpad or a keyboard.
    The control element 211 can comprise a processor unit for determining the control command. The control element 211 and the positioning device 205 can be connected to one another in terms of communication technology.
    According to one embodiment, the display 213, the input device 209 and / or the control element 211 are integrated in a data processing system, for example a computer, a laptop, a tablet or a smartphone. The data processing system can be connected in terms of communication technology to the positioning device 205 and the image recording device 207. The data processing system can be an external device, in particular an external device that can be worn by the user.
    The positioning device 205 can comprise a substrate positioning device 215 for the first substrate 201 and a substrate positioning device 217 for the second substrate 203. The substrate positioning devices 215, 217 can be designed to move the first substrate 201 and / or the second substrate 203, and can each have one or more degrees of freedom. The substrate positioning devices 215, 217 can each have supports and / or holders for the substrates 201, 203.
    / 22nd
    9 The substrate positioning devices 215, 217 may comprise stages. The
    Substrate positioning devices 215, 217 can each be designed for translation along up to three linear axes and / or rotation around up to three axes of rotation.
    For example, the substrate positioning devices 215, 217 each comprise xy stages with an additional axis of rotation in the z direction.
    The substrate positioning device 215 for the first substrate 201 may comprise a mask holder or mask. The substrate positioning device 217 for the second substrate 203 can comprise a chuck, in particular a wafer chuck.
    The exemplary image recording device 207 in FIG. 2 further comprises two image cameras 219, 221, which are arranged above the positioning device 205 and are oriented for recording the image in the direction of the substrates 201, 203. The upper substrate positioning device 215 in FIG. 2 can be light-transparent, and the first substrate 201 can be at least partially transparent. Thus, the image cameras 219, 221 in the configuration shown in FIG. 2 can record common image recordings of the substrates 201, 203 arranged one above the other.
    According to one embodiment, additional image cameras are arranged under the positioning device 205. In such a configuration, the upper image cameras 219, 221 and the lower image cameras can each record images of the sides of the substrates 201, 203 facing away from one another. These images can be used for
    Generation of the common image can be overlaid. In this way, alignment of the substrates can be made possible on the basis of structures on the opposite sides of the substrates (BSA, back side alignment).
    According to a further embodiment, the image recording device 207 or the image cameras 219, 221 can also be arranged between the substrates in order to enable inter-substrate alignment (ISA).
    According to one embodiment, the image recording device 207 comprises a movement device for positioning the number of image cameras 219, 221.
    The movement device can be controllable by the user by means of the input device 209. The user can thus target specific surface areas, for example to ensure that alignment marks of both substrates are visible in each common image recording.
    According to a further embodiment, the image recording device 207 comprises at least one microscope. For example, each image camera 219, 221 can have a microscope. With the microscope, the substrates can be shown enlarged in the common image and thus a particularly precise marking of pixels can be made possible. For example, / 22
    - 10 the user marked the center or another feature of the alignment marks very precisely in an enlarged representation, so that these can be aligned with one another with high accuracy.
    According to a further embodiment, the image cameras 219, 221 are digital cameras with a magnification or zoom function.
    According to a further embodiment, a magnification setting of the image recording device 207 can be set by means of the input device 209. For example, the user first moves the image recording devices 207 until alignment marks are visible in each image recording. The user then enlarges the representation of the alignment marks in the image recording in order to enable the alignment marks to be marked as accurately as possible.
    3a-d show schematic representations of a common image 301 of two substrates 201, 203 during an alignment of the substrates 201, 203 according to one embodiment.
    The image shown in FIGS. 3a-d can be displayed by the display 213 during the alignment process.
    The common image 301 in FIGS. 3a-d each shows an alignment mark 303 of the first substrate and a complementary alignment mark 305 of the second substrate 203. For example, the alignment mark 303 is a wafer target and the alignment mark 305 is a mask target.
    The alignment marks 303, 305 are offset in FIG. 3a, since the substrates 201, 203 are not yet aligned with one another. “Offset” means that the alignment marks 303, 305, viewed perpendicular to a plane that is parallel to the substrates, are not offset from one another but laterally offset from one another. However, the substrates should be aligned with each other for further processing. For this purpose, a user can move the wafer target 305 exactly under the mask target 303. For this purpose, he can mark the respective positions of the targets 303, 305 using the input device.
    3b shows this marking of the alignment marks 303, 305 by the user. The user clicks with a mouse pointer in the center of the alignment mark 303 of the first substrate 201 and then in the center of the alignment mark 305 of the second substrate 203.
    It can also be provided that the control system assigns a click on an adjustment mark, even if it is not “hit” exactly, to the closest adjustment mark.
    The control element 211 can calculate an offset (displacement) of the substrates 201, 203 on the basis of the marked pixels. A machine type, for example / 22
    - 11 manual or automatic, a machine status and an alignment mode, for example TSA, BSA or ISA, are taken into account. The offset can be calculated as a displacement in the x or y direction, as a translation and / or as a rotation. The control element 211 can determine a control command for actuating the positioning device 205 on the basis of the determined offset.
    3c shows an alignment of the substrates to one another. In the example in FIG. 3c, only the second substrate 203 is moved, so that the alignment mark 305 of the second substrate 203, for example the wafer, moves in the direction of the alignment mark 303 of the first substrate 201, for example the mask. The marked pixels, which are aligned with each other, are shown as two points connected with an arrow.
    3d shows the superimposed alignment marks 303, 305 after the successful alignment of the substrates 201, 203.
    To change the orientation of the substrates 201, 203, the user can also mark any other image points in the common image 301 instead of the centers of alignment marks, as shown in FIGS. 3a-d. The surface positions of the substrates 201, 203 which correspond to these marked pixels are then aligned with one another.
    The process shown in FIGS. 3a-d can then be repeated, for example with increased magnification, in order to carry out a fine alignment of the substrates 201, 203.
    4a-b show schematic representations of a first common image 401 and a second common image 403 of two substrates 201, 203 during an alignment of the substrates 201, 203 according to a further embodiment.
    Both images 401, 403 each show different ones arranged one above the other
    Surface sections of the substrates 201, 203. In this case, for example, one of the images 401, 403 is taken by one of the image cameras 219, 221 of the image recording device 207 from FIG. 2. Alternatively, both images can also be recorded by only one image camera which travels different surface sections of the substrates 201, 203 (single TSA). In both images 401, 403, alignment marks 405-1, 405-2 of the first substrate 201 and alignment marks 407-1, 407-2 of the second substrate 203 are visible.
    The display 213 can be designed to display both images 401, 403 side by side. Alternatively, the images 401, 403 can also be displayed one after the other or alternately, in which case the user can select which of the images 401, 403 is currently being displayed to them.
    / 22nd
    4a shows a marking of the respectively complementary alignment marks 405-1, 407-1, 405-2, 405-2 in both images 401, 403. The user clicks with the mouse pointer, for example, one after the other into the center of the alignment marks 405- 1, 407-1 in the first image 401 and then in the center of the alignment marks 405-2, 407-2 in the second image 403.
    In an optional process step, before marking the complementary alignment marks 405-1, 407-1, 405-2, 405-2, the user can first mark only the alignment marks 405-1, 405-2 of one of the substrates 201, 203, whereupon these are identified by means of moving the image cameras 219, 221 into the middle of the common images 401, 403. The respectively complementary alignment marks 405-1, 407-1, 405-2, 405-2 can then be marked, as shown in FIG. 4a.
    4b shows the subsequent alignment of the substrates to one another. The substrates are aligned with one another in such a way that the complementary alignment marks 405-1, 407-1 and 405-2, 407-2 are arranged one above the other. The alignment takes place via a movement of the substrates 201, 203 by means of the positioning device 205.
    As an alternative to the simultaneous alignment of the alignment marks 405-1, 407-1 in the first image 401 and the alignment marks 405-2, 407-2 in the second image 403 shown in FIG. 4b, only the alignment marks 405 can be done in a first step -1, 407-1 are marked in the first image 401 and aligned with one another, and in a subsequent second step the alignment marks 405-2, 407-2 are marked in the second image 403 and aligned with one another. In this case, the control element 211 can control the positioning device 207 in such a way that the alignment of the alignment marks 405-1, 407-1 that were aligned first during the
    The procedure and alignment of the further alignment marks 405-2, 407-2 is retained.
    Aligning substrates in accordance with the method shown in FIGS. 3a-d and 4a-b is much easier and more intuitive for the user than direct control of a positioning device, as is customary, for example, in conventional manual mask aligners. With direct control using a control device such as a joystick, the user controls the rotation and x and y translation of the substrates directly. This presupposes that the user knows the exact mode of operation of the respective positioning device and can estimate in which direction a rotation of the substrates moves the individual alignment marks. Such knowledge is not required when aligning the substrates 201, 203 by marking pixels.
    In addition, no target training is required for alignment, as is the case with automatic alignment. A user selects the positions of the substrates to be stacked, which can reduce the complexity of the device 200.
    / 22nd
    In addition, no auto-alignment-compatible alignment marks are required to carry out method 100. Any suitable structures, for example also nonies or long lines along the substrate surface, can be used to align the substrates. Since the user marks the structures themselves, they can be designed differently for each substrate.
    The method 100 can also be used additionally in systems which are designed for automatic alignment (autoalignment). For example, in the event of an error, the user can manually correct the alignment of substrates or, for special substrates with unsuitable alignment marks, for example during process development, carry out the alignment himself.
    / 22nd
    - 14 list of reference symbols
    method
    Deploy
    take up
    Show
    To mark
    Determine
    Align
    Device first substrate second substrate
    positioning device
    Image recording device
    input device
    control
    display
    Substrate positioning means
    Substrate positioning means
    camera
    camera
    image
    Alignment mark of the first substrate
    Alignment mark of the second substrate first image / 22nd
    - 15 403 second picture
    405-1 alignment mark of the first substrate
    405-2 alignment mark of the first substrate
    407-1 alignment mark of the second substrate
    407-2 alignment mark of the second substrate / 22
    权利要求:
    Claims (16)
    [1]
    1. A method (100) for aligning a first substrate (201), in particular a mask, to a second substrate (203), in particular a wafer, with:
    Inserting (101) the first substrate (201) and the second substrate (203) into a positioning device (205);
    Capturing (103) at least one common image (301) of the first substrate (201) and the second substrate (203);
    Displaying (105) the image (301);
    Marking (107) a plurality of pixels in the image (301) by a user; and
    Determining (109) a control command for activating the positioning device (205) on the basis of the marked pixels, so that the substrates (201, 203) are aligned with one another.
    [2]
    2. The method (100) according to claim 1, wherein the substrates (201, 203) in response to receiving the control command from the positioning device (205) are laterally aligned.
    [3]
    3. The method (100) according to claim 1 or 2, wherein a machine state, for example a current process step, a machine type or a machine configuration, is detected before the determination (109) of the control command.
    [4]
    4. The method (100) according to claim 3, wherein the control command is additionally determined on the basis of the detected machine state.
    [5]
    5. The method (100) according to any one of claims 1 to 4, wherein the marking (107) of the plurality of pixels in the image is carried out by the user by clicking on the pixels, for example with a peripheral device, or by means of a dragging movement of a mouse pointer.
    [6]
    6. The method (100) according to any one of claims 1 to 5, wherein the marking (107) of the plurality of pixels in the image (301) is carried out by the user by touching a touch display.
    [7]
    7. The method (100) according to one of claims 1 to 6, wherein the method step of capturing (103) the image comprises capturing a first common image (401) and a second common image (403) of the substrates (201, 203), being the first and the
    17/22
    - 17 second common image (401, 403) can be displayed side by side, one above the other or alternately.
    [8]
    8. The method (100) according to claim 7, wherein at least two pixels in the first common image (401) and at least two pixels in the second common image (403) are marked.
    [9]
    9. Device (200) for aligning a first substrate (201) with a second substrate (203), comprising:
    a positioning device (205) into which the substrates (201, 203) can be inserted;
    an image recording device (207) which is designed to record at least one common image (301) of the substrates (201, 203) inserted in the positioning device (205);
    an input device (209) with which a multiplicity of pixels in the image (301) can be marked; and a control element (211) which is designed to determine a control command for actuating the positioning device (205) on the basis of the marked pixels.
    [10]
    10. The device (200) according to claim 9, wherein the device comprises a display (213), in particular a screen or a display, for displaying the image (301).
    [11]
    11. The device (200) according to claim 9 or 10, wherein the display (213) and the
    Form input device (209) a touch display.
    [12]
    12. The device (200) according to one of claims 9 to 11, wherein the input device (209) is a peripheral device, for example a mouse, a trackball or a touchpad.
    [13]
    13. The device (200) according to one of claims 9 to 12, wherein the positioning device (205) comprises a substrate positioning device (215) for the first substrate (201) and / or a substrate positioning device (217) for the second substrate (203).
    [14]
    14. The device (200) according to one of claims 9 to 13, wherein the image recording device (207) comprises at least one microscope.
    [15]
    15. The device (200) according to any one of claims 9 to 14, wherein the image recording device (207) comprises a number of image cameras (219, 221) which are arranged above, below and / or within the positioning device (205).
    [16]
    16. The device (200) according to any one of claims 9 to 15, wherein the image recording device (207) comprises a movement device for positioning the number of image cameras (219, 221), the movement device being controllable by means of the input device.
    18/22
    1.4
    100
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    同族专利:
    公开号 | 公开日
    CN108807252A|2018-11-13|
    DE102018108948A1|2018-11-08|
    US20180323069A1|2018-11-08|
    KR20180122953A|2018-11-14|
    NL2018856B1|2018-11-14|
    JP2018189953A|2018-11-29|
    AT519921A3|2020-02-15|
    TW201843761A|2018-12-16|
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    法律状态:
    2021-05-15| REJ| Rejection|Effective date: 20210515 |
    优先权:
    申请号 | 申请日 | 专利标题
    NL2018856A|NL2018856B1|2017-05-05|2017-05-05|Method and device for aligning a first substrate with a second substrate|
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